Semiconductor Manufacturing
How Meldin® Can Boost ROI for Plasma Deposition Components
The semiconductor industry is booming in the US and the push is on to increase chip production to meet demand. This guide highlights the challenges in selecting materials for plasma deposition components and introduces Meldin® 7001 polyimide as an alternative to Vespel® SP-1.
The advantages of Meldin® include:
- Resistance to extreme temperatures and chemicals, low outgassing, and strong dielectric insulation properties
- Exceptional dimensional stability, and wear resistance, delivering outstanding service life in extremely hazardous environments
- The ability to retain stability in the face of repetitive thermal cycling
In addition, this guide demonstrates how the the Meldin® 7001 manufacturing process results in a material with improved properties over alternatives at a competitive price point.
