The “New Meldin®” Opens Up New Possibilities for High-Temperature Polyimides
Applications for high-performance polyimides have always been limited by one concern above all...
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Meldin® 7001 is the unfilled base polyimide resin. It is ideal for thermal insulating applications, vacuum components, and high temperature structural parts.
Lighter weight than metals and more ductile than ceramics, Meldin® 7001 can be found where metal replacement is desirable, such as semiconductor applications, where it can replace aluminum, ceramics, and other high-performance plastics.
As it is a thermosetting plastic, it has no glass transition temperature and no melting point, making it ideal for high temperature applications.
Description |
Unfilled Thermoset Polyimide |
Color |
Brown |
Benefits |
Strong thermal and electrical insulation, |
Working Temperature Range | -423°F to +600°F [-253°C to +315°C] |
Manufacturing Methods | Isostatic molded Direct formed Compression molded |
Shape Availability | Rod (up to 37") Sheet (12"x12") Finished parts Tubes, discs, blocks |
Agency Approvals |
ASTM D6456-99 Type 1 AMS3644 Class 1 Meets Mil-R-46198 Type 1 (superceded) Meets Honeywell MCS5016 Type 1 |
Replaces | Vespel® SP-1 |
Vespel is a Registered Trademark of DuPont Polymers, Inc.
Applications for high-performance polyimides have always been limited by one concern above all...